• PSE, NIZO Announce Centre Of Excellence For Food Product & Process Modelling

    At today’s Advanced Process Modelling Forum Process Systems Enterprise (PSE), the Advanced Process Modelling company, and NIZO, the world’s leading food & nutrition contract research organisation, announced the formation of the Centre of Excellence (CoE) for Food Product and Process Modelling. This Smart News Release features multimedia. View the full release here: The CoE will provide a single point service that combines mechanistic product and process modelling tools with industry-leading food characterisation techniques

  • IDC And Döhler Win Prestigious Global Packaging Award

    International Dispensing Corporation (IDC; IDND) and The Döhler Group are proud to announce that they have won a Marking Award, a global packaging competition sponsored by the Food & Beverage Innovation Forum (FBIF) in Shanghai

  • Sanderson Farms, Inc. Announces Production Agreement With House Of Raeford Farms

    Sanderson Farms, Inc. announced recently that the Company has signed an agreement to continue processing chickens grown by House of Raeford Farms at the Sanderson Farms poultry processing facility located in St. Pauls, North Carolina

  • Consolidated Container Company Plans To Ship 200 Million Eco-Friendly Dura-Lite Bottles By Year’s End

    The award-winning family of Dura-Lite containers, co-developed by Consolidated Container Company (CCC) and Milacron’s Uniloy product brand, continues to impress customers, consumers, and industry experts since its launch in 2016

  • Distributed Modular I/O In The Food Processing And Beverage Industry For Hygienic Pressure Wash-Down Applications

    Balluff is pleased to introduce industry's first machine mount, IP69K protection rated, ECOLAB certified distributed I/O modules powered by EtherNet/IP, PROFINET, and IO-Link. End users and machine builders of automation in food, meat, dairy and beverage industries that need to follow stringent food safety requirements can now utilize full benefits of distributed modular I/O architecture for all the required I/O and sensor connectivity

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